点击图片查看大图
选点波峰焊接工艺简介：
（1）本设备采用的选点焊接方式是“多喷嘴群焊”方式，又称为“浸入选择焊系统 ”。
（2）本焊接工艺的特点：
A、有多个焊锡嘴，并与PCB待焊点是一对一设计的，对不同的PCB需制作专用的焊锡嘴。
B、产量接近于传统波峰焊设备，因采用机械手移动PCB，提高了设备生产节拍。
C、可焊接直径0.7mm～10mm的焊点，短引脚及小尺寸焊盘的焊接工艺更稳定，桥接可能性也小。
D、相邻焊点边缘、器件及焊嘴间的距离应大于2mm。同时，焊嘴的尺寸尽可能大，保证焊接工艺的稳定。
F、因采用锡炉固定，PCB移动的焊接方式，波峰稳定，焊接拉尖桥连少。
Selective wave soldering process descript ion:
(1) this device adopts the way of choosing welding way is "more welding nozzle group", also known as the "going to choose welding system".
(2) the characteristics of the welding process:
A, there are multiple solder mouth, and is one to one design for the PCB solder joints, different PCB needs to make special soldering tin mouth.
B, yield close to conventional wave soldering equipment, for using manipulator moving PCB, improved the equipment production rhythm.
C, welding diameter of 0.7 mm ~ 10 mm of solder joints, short pin and small size solder welding process is more stable, bridging possibility is also small.
D, adjacent edge of solder joints, devices and the distance between welding nozzle should be greater than 2 mm. At the same time, the size of the welding nozzle as large as possible, to ensure the stability of welding process.
F, fixed with tin furnace, PCB mobile welding way, wave stability, even less welding icicles bridge.
设备基本功能:
1、基本工艺流程： 选点喷雾（可编程）→选点预热→选点焊接
2、生产节拍：30S。每小时可生产120块PCB。
3、可生产其他最大治具板L370*W300、板上下元件高度小于40mm的PCB。生产不同PCB时，预热喷口、焊接喷口要更换；喷雾要重新编程。
4、控制方式：PLC+触摸屏方式。可调的工艺参数：喷雾量、预热温度、焊接温度、喷锡高度、输送速度。
The basic function of equipment:
1, the basic technological process: click on spray (programmable) - click on preheat - click on welding
2, production rhythm: 30 s. It can produce 120 pieces of PCB per hour.
3, it can produce the most other rectification board L370 * W300, PCB board component height less than 40 mm up and down. Different PCB production, preheat nozzle, welding nozzle to replace; The spray to be reprogrammed.
4, control mode: PLC + touch screen. Adjustable parameters: spray amount, preheating temperature, welding temperature, height of tin, transmission speed.
